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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17742672
Filing Dt:
05/12/2022
Publication #:
Pub Dt:
11/24/2022
Inventors:
Takaaki ISHIZU, Yuta NAKANO
Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Assignment: 1
Reel/Frame:
059986/0115Recorded: 05/12/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/14/2022
Exec Dt:
04/14/2022
Assignee:
TENJINKITA-MACHI 1-1, TERANOUCHI-AGARU 4-CHOME
HORIKAWA-DORI, KAMIGYO-KU, KYOTO-SHI
KYOTO, JAPAN 602-8585
Correspondent:
OSTROLENK FABER LLP
845 THIRD AVENUE
8TH FLOOR
NEW YORK, 10022 UNITED STATES

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