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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/22/2023
Application #:
17326906
Filing Dt:
05/21/2021
Publication #:
Pub Dt:
11/24/2022
Inventors:
Takahito Watanabe, Risa Miyazawa, Hiroyuki Mori
Title:
SIDE PAD ANCHORED BY NEXT ADJACENT VIA
Assignment: 1
Reel/Frame:
056314/0501Recorded: 05/21/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/18/2021
Exec Dt:
05/20/2021
Exec Dt:
05/17/2021
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION PATENT CENTER
1701 NORTH STREET
B/256-3
ENDICOTT, NY 13760

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