Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17327199
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Filing Dt:
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05/21/2021
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Publication #:
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Pub Dt:
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11/24/2022
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Inventors:
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Dawson YEE, Craig S. RANTA, Cliff C. LEE, Douglas P. KELLEY, Matthew David TURNER et al
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Title:
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HIGH TEMPERATURE SUPERCONDUCTOR-BASED INTERCONNECT SYSTEMS WITH A LOWERED THERMAL LOAD FOR INTERCONNECTING CRYOGENIC ELECTRONICS WITH NON-CRYOGENIC ELECTRONICS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ONE MICROSOFT WAY |
REDMOND, WASHINGTON 98052 |
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MICROSOFT CORPORATION |
ONE MICROSOFT WAY |
REDMOND, WA 98052 |
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05/13/2024 06:52 AM
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