Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17620999
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Filing Dt:
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12/20/2021
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Publication #:
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Pub Dt:
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12/01/2022
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Inventors:
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Masashi OKANIWA, Kentaro TAKANO, Tsuyoshi KIDA
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Title:
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RESIN COMPOSITION, RESIN SHEET, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1008324 |
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| GREENBLUM & BERNSTEIN, P.L.C. |
| 1950 ROLAND CLARKE PLACE |
| RESTON, VA 20191 |
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