Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/06/2024
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Application #:
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17833107
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Filing Dt:
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06/06/2022
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Publication #:
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Pub Dt:
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12/01/2022
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Inventors:
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Jeonggyu JO, Jungchul AN, Byunghoon LEE
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Title:
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ELECTRONIC DEVICE COMPRISING BONDING LAYER IN CONTACT WITH ACTIVE AREA OF DIGITIZER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| NIXON & VANDERHYE PC / SAMSUNG |
| 901 N. GLEBE RD., 11TH FLOOR |
| ARLINGTON, VA 22203 |
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