Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/08/2023
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Application #:
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17331196
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Filing Dt:
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05/26/2021
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Publication #:
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Pub Dt:
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12/01/2022
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Inventor:
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Thomas Edward DUNGAN
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Title:
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COPPER-BONDED MEMORY STACKS WITH COPPER-BONDED INTERCONNECTION MEMORY SYSTEMS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| BAKER & HOSTETLER LLP |
| 600 ANTON BLVD, SUITE 900 |
| COSTA MESA, CA 92626 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, NW |
| SUITE 600 |
| WASHINGTON, DC 20007 |
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