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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/06/2024
Application #:
17377280
Filing Dt:
07/15/2021
Publication #:
Pub Dt:
12/01/2022
Inventors:
Chi-Min CHANG, Ching-Sheng CHEN, Jun-Rui HUANG, Wei-Yu LIAO, Yi-Pin LIN
Title:
INTERLAYER CONNECTIVE STRUCTURE OF WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
056873/0168Recorded: 07/15/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/28/2021
Exec Dt:
06/28/2021
Exec Dt:
06/28/2021
Exec Dt:
06/28/2021
Exec Dt:
06/28/2021
Assignee:
NO.38, XINGBANG RD., GUISHAN IND. PARK
TAOYUAN, TAIWAN 330
Correspondent:
CKC & PARTNERS CO., LLC
12345 LAKE CITY WAY NE, NO. 283
SEATTLE, WA 98125

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