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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17621362
Filing Dt:
12/21/2021
Publication #:
Pub Dt:
12/08/2022
Inventors:
Masashi OKANIWA, Kohei HIGASHIGUCHI, Takahito SEKIDO, Kentaro TAKANO, Tsuyoshi KIDA
Title:
FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
058941/0601Recorded: 02/09/2022Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/24/2022
Exec Dt:
01/24/2022
Exec Dt:
01/24/2022
Exec Dt:
01/24/2022
Exec Dt:
01/24/2022
Assignee:
5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN 1008324
Correspondent:
GREENBLUM & BERNSTEIN, P.L.C.
1950 ROLAND CLARKE PLACE
RESTON, VA 20191

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