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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17338928
Filing Dt:
06/04/2021
Publication #:
20220390694
Pub Dt:
12/08/2022
Inventors:
Chia-Pin Chiu, Kaveh Hosseini, Thu Ngoc Tran, Yew Fatt Kok, Kumar Abhishek Singh et al
Title:
THERMAL INTERFACE STRUCTURES FOR OPTICAL COMMUNICATION DEVICES
Assignment: 1
Reel/Frame:
056455/0536Recorded: 06/07/2021Pages: 22
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHIU, CHIA-PIN
Exec Dt:
06/01/2021
HOSSEINI, KAVEH
Exec Dt:
06/03/2021
TRAN, THU NGOC
Exec Dt:
06/02/2021
KOK, YEW FATT
Exec Dt:
06/01/2021
SINGH, KUMAR ABHISHEK
Exec Dt:
06/01/2021
LI, XIAOQIAN
Exec Dt:
06/01/2021
TEJEDA FERRARI, MARELY
Exec Dt:
06/02/2021
MAHAJAN, RAVINDRANATH
Exec Dt:
06/01/2021
MA, KEVIN
Exec Dt:
06/01/2021
THIELEN, CASEY
Exec Dt:
06/03/2021
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95054
Correspondent:
GREEN, HOWARD, & MUGHAL LLP.
5 CENTERPOINTE DRIVE
SUITE 400
LAKE OSWEGO, OR 97035

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