Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17663937
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Filing Dt:
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05/18/2022
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Publication #:
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Pub Dt:
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12/08/2022
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Inventors:
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Yung-chen LIN, Chi-I LANG, Ho-yung HWANG
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Title:
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ATOMIC LAYER ETCHING OF RU METAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| PATTERSON & SHERIDAN, LLP - - APPLIED MA |
| 24 GREENWAY PLAZA, SUITE 1600 |
| HOUSTON, TX 77046 |
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