Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/19/2024
|
Application #:
|
17889054
|
Filing Dt:
|
08/16/2022
|
|
Publication #:
|
|
Pub Dt:
|
12/08/2022
| | | | |
|
Inventors:
|
Daigi KAMIMURA, Tomoshi TANIYAMA, Kenji SHIRAKO, Hironori SHIMADA, Akira HORII et al
|
|
Title:
|
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 3-4, KANDAKAJI-CHO |
| CHIYODA-KU |
| TOKYO, JAPAN 101-0045 |
|
|
|
|
| VOLPE KOENIG |
| 30 SOUTH 17TH STREET, 18TH FLOOR |
| PHILADELPHIA, PA 19103 |
|
|
Search Results as of:
04/28/2024 11:21 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
