Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17733296
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Filing Dt:
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04/29/2022
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Publication #:
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Pub Dt:
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12/15/2022
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Inventors:
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Sawako SHODA, Tomoyuki MIZUNASHI
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Title:
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CURABLE SILICONE RESIN COMPOSITION, SILICONE RESIN CURED MATERIAL, DAM MATERIAL, ENCAPSULANT, AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4-1, MARUNOUCHI 1-CHOME, CHIYODA-KU |
TOKYO, JAPAN 100-0005 |
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AARON L. WEBB |
OLIFF PLC |
P.O. BOX 320850 |
ALEXANDRIA, VA 22320-4850 |
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05/10/2024 07:44 AM
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