Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17566398
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Filing Dt:
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12/30/2021
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Publication #:
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Pub Dt:
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12/15/2022
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Inventors:
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Sheng HU, Jun ZHOU, Peng SUN, Qiong ZHAN, Senhua SHI, Hu YANG
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Title:
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LARGE DIE WAFER, LARGE DIE AND METHOD OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 18 GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE |
| WUHAN, HUBEI, CHINA 430205 |
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| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 4000 LEGATO RD., SUITE 310 |
| FAIRFAX, VA 22033 |
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