Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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17347065
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Filing Dt:
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06/14/2021
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Publication #:
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Pub Dt:
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12/15/2022
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Inventors:
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Junghwan Jang, Myongsuk Kang, Giwoong Nam
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Title:
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Semiconductor Device and Method of Forming Vertical Interconnect Structure for POP Module
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE 768442 |
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STATS CHIPPAC/PATENT LAW GROUP: ATKINS A |
123 WEST CHANDLER HEIGHTS ROAD, UNIT 125 |
CHANDLER, AZ 85248 |
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05/31/2024 12:09 PM
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