Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17779801
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Filing Dt:
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05/25/2022
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Publication #:
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Pub Dt:
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12/22/2022
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Inventors:
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Haruya SAKUMA, Hisahiko YOSHIDA, Sei UEMURA, Masateru NISHIOKA, Kenichi TOMITSUKA et al
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Title:
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Magnetic-field melting solder, and joining method in which same is used
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO, |
| ADACHI-KU, TOKYO, JAPAN 1208555 |
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| 3-1, KASUMIGASEKI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 1008921 |
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| BRIAN S. MYERS |
| 100 S. JEFFERSON ROAD |
| SUITE 202 |
| WHIPPANY, NJ 07981 |
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04/29/2024 08:58 AM
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