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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17833928
Filing Dt:
06/07/2022
Publication #:
Pub Dt:
12/22/2022
Inventors:
Shuta Akatsuka, Kengo Ohta, Sakie Okada, Yutaka Hashimoto
Title:
FLUX AND SOLDER PASTE
Assignment: 1
Reel/Frame:
060116/0768Recorded: 06/07/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/02/2022
Exec Dt:
06/02/2022
Exec Dt:
06/02/2022
Exec Dt:
06/02/2022
Assignee:
23, SENJU-HASHIDO-CHO
ADACHI-KU, TOKYO, JAPAN 120-8555
Correspondent:
NIXON PEABODY LLP
799 9TH STREET NW
SUITE 500
WASHINGTON, DC 20001

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