Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/13/2024
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Application #:
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17463846
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Filing Dt:
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09/01/2021
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Publication #:
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Pub Dt:
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12/22/2022
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Inventors:
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Kai-Hung HSIAO, Chi-Chung JEN, Yu-Chun SHEN, Jhang-Jie JIAN, Wen-Chih CHIANG
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Title:
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SEMICONDUCTOR WAFER PROCESSING SYSTEM AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6, HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| COOPER LEGAL GROUP, LLC |
| 1388 RIDGE ROAD, UNIT 1 |
| HINCKLEY, OH 44233 |
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05/31/2024 12:46 AM
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