Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/20/2024
|
Application #:
|
17523955
|
Filing Dt:
|
11/11/2021
|
|
Publication #:
|
|
Pub Dt:
|
12/22/2022
| | | | |
|
Inventors:
|
Chia-Kuei HSU, Shu-Shen YEH, Po-Yao LIN, Shin-Puu JENG, Ming-Chih YEW
|
|
Title:
|
DIE CORNER REMOVAL FOR MOLDING COMPOUND CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 8, LI-HSIN 6 ROAD |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN ROC 30077 |
|
|
|
|
| THE MARBURY LAW GROUP, PLLC |
| 11800 SUNRISE VALLEY DRIVE |
| 15TH FLOOR |
| RESTON, VA 20191 |
|
|
Search Results as of:
05/17/2024 11:03 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
