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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17850250
Filing Dt:
06/27/2022
Publication #:
Pub Dt:
12/29/2022
Inventor:
Shingo KOIWA
Title:
SUBSTRATE SUPPORT, SUBSTRATE SUPPORT ASSEMBLY, AND PLASMA PROCESSING APPARATUS
Assignment: 1
Reel/Frame:
060550/0727Recorded: 07/19/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/04/2022
Assignee:
3-1 AKASAKA 5-CHOME
MINATO-KU
TOKYO, JAPAN 107-6325
Correspondent:
NATH, GOLDBERG & MEYER
112 S WEST ST
ALEXANDRIA, VA 22314

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