Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/05/2024
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Application #:
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17458811
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Filing Dt:
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08/27/2021
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Publication #:
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Pub Dt:
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12/29/2022
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Inventors:
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Allen Marfil Descartin, Mariano Layson Ching JR., Jun Li
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Title:
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LEAD-FRAME ASSEMBLY, SEMICONDUCTOR PACKAGE AND METHODS FOR IMPROVED ADHESION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6501 WILLIAM CANNON DRIVE WEST |
| AUSTIN, TEXAS 78735 |
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| NXP USA, INC. |
| 6501 WILLIAM CANNON DRIVE WEST |
| AUSTIN, TX 78735 |
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