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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17721499
Filing Dt:
04/15/2022
Publication #:
Pub Dt:
12/29/2022
Inventors:
Wen-Yi LIN, Kuang-Chun Lee, Chien-Chen Li, Chen-Shien Chen
Title:
SYSTEMS FOR SEMICONDUCTOR PACKAGE MOUNTING WITH IMPROVED CO-PLANARITY AND METHODS FOR FORMING THE SAME
Assignment: 1
Reel/Frame:
060288/0146Recorded: 06/23/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/10/2022
Exec Dt:
03/20/2022
Exec Dt:
06/22/2022
Exec Dt:
03/13/2022
Assignee:
NO. 8, LI-HSIN 6 ROAD
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN ROC 30077
Correspondent:
THE MARBURY LAW GROUP, PLLC
11800 SUNRISE VALLEY DRIVE
15TH FLOOR
RESTON, VA 20191

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