Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17851179
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Filing Dt:
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06/28/2022
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Publication #:
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Pub Dt:
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12/29/2022
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Inventors:
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Wentao YANG, Loucheng DAI, Chaofan SONG, Boning HUANG, Zhihua LIU
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Title:
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SEMICONDUCTOR DEVICE AND RELATED CHIP AND PREPARATION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HUAWEI ADMINISTRATION BUILDING |
| BANTIAN, LONGGANG DISTRICT, GUANGDONG |
| SHENZHEN, CHINA 518129 |
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| RIMON PC - HW |
| 423 WASHINGTON STREET |
| SUITE 600 |
| SAN FRANCISCO, CA 94111 |
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