Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/22/2023
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Application #:
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17779850
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Filing Dt:
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05/25/2022
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Publication #:
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Pub Dt:
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01/05/2023
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Inventors:
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Hirotaka MATSUNAGA, Hiroyuki MORI, Yuki ITO, Hiroyuki MATSUKAWA
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Title:
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COPPER ALLOY, COPPER ALLOY PLASTIC-PROCESSED MATERIAL, COMPONENT FOR ELECTRONIC AND ELECTRIC DEVICES, TERMINAL, BUS BAR, AND HEAT-DIFFUSING SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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| MITSUHIRO HARAGUCHI, LEASON ELLIS LLP |
| ONE BARKER AVENUE |
| FIFTH FLOOR |
| WHITE PLAINS, NY 10601 |
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