Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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17364735
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Filing Dt:
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06/30/2021
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Publication #:
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Pub Dt:
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01/05/2023
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Inventors:
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Ashok Surendra Prabhu, Kurt Edward Sincerbox, Anindya Poddar, Hau Nguyen et al
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Title:
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FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12500 TI BOULEVARD |
| MS 3999 |
| DALLAS, TEXAS 75243 |
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| TEXAS INSTRUMENTS INCORPORATED |
| P O BOX 655474 |
| MS 3999 |
| DALLAS, TX 75265 |
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04/28/2024 05:09 AM
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