Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17779927
|
Filing Dt:
|
05/25/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/05/2023
| | | | |
|
Inventors:
|
Kam Wah Leong, QiChuan Yu, Yoong Kheng Teoh, Sung Hoe Hng, Kyaw Oo Aung
|
|
Title:
|
WAFER LEVEL CHIP SCALE PACKAGING
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 7000 ANG MO KIO AVENUE 5 |
| #02-00 |
| SINGAPORE, SINGAPORE 569877 |
|
|
|
|
| MICHAEL BEST & FRIEDRICH LLP |
| 790 N. WATER STREET, STE. 2500 |
| MILWAUKEE, WI 53202 |
|
|
Search Results as of:
06/09/2024 06:41 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
