Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17804175
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Filing Dt:
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05/26/2022
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Publication #:
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Pub Dt:
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01/12/2023
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Inventors:
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Hao-Yu Wang, Akinori Uchino, Atsushi Ohyama
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Title:
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HEAT SINK, COOLING MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 151 LORONG CHUAN |
| #02-01 NEW TECH PARK |
| SINGAPORE, SINGAPORE 556741 |
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| SHIMOKAJI & ASSOCIATES, P.C. |
| 22431 ANTONIO PARKWAY |
| SUITE B160-468 |
| RANCHO SANTA MARGARI, CA 92688 |
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