Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17783830
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Filing Dt:
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06/09/2022
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Publication #:
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Pub Dt:
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01/12/2023
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Inventor:
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Yoshimitsu MAEDA
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Title:
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IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1-1 SHIBAURA, MINATO-KU |
| TOKYO, JAPAN 1080023 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET NW |
| WASHINGTON, DC 20007 |
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05/14/2024 05:19 AM
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