Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17944105
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Filing Dt:
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09/13/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Inventors:
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Qingfeng CUI, Xinghuo XIANG, Weichen LIU, Xiaoqin WU, Genhong CHEN, Jianxin CAO et al
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Title:
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PACKAGING PART, PACKAGING ASSEMBLY, AND CHIP READ WRITE METHOD USING PACKAGING PART
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.3883 ZHUHAI AVENUE, XIANGZHOU DISTRICT |
| BUILDING 01/F2 & F7 BLOCK B,BUILDING 02/F1 BLOCK A |
| ZHUHAI, CHINA 519060 |
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| ANOVA LAW GROUP PLLC |
| 21495 RIDGETOP CIRCLE |
| SUITE 300 |
| STERLING, VA 20166 |
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