Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17686856
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Filing Dt:
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03/04/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Inventors:
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Chih-Hao Chen, Pu Wang, Po-Yuan Cheng, Li-Hui Cheng
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Title:
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Heat Dissipation Structures for Integrated Circuit Packages and Methods of Forming the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL LLP/TSMC |
17950 PRESTON ROAD, SUITE 1000 |
DALLAS, TX 75252 |
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05/12/2024 03:52 PM
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