Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/06/2024
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Application #:
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17648314
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Filing Dt:
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01/19/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Inventors:
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Wenli ZHAO, Jie BAI
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Title:
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SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK |
| ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA |
| HEFEI CITY, ANHUI, CHINA 230601 |
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| COOPER LEGAL GROUP LLC |
| 1388 RIDGE ROAD, UNIT 1 |
| HINCKLEY, OH 44233 |
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