Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17784638
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Filing Dt:
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06/11/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Inventors:
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Hiroaki YASUDA, Takehiro HAMAMURA, Takao ITO
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Title:
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SEMICONDUCTOR PRODUCTION DEVICE SEALING MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8303 |
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| MASCHOFF BRENNAN |
| 1389 CENTER DRIVE, SUITE 300 |
| PARK CITY, UT 84098 |
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04/29/2024 07:24 AM
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