Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17786173
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Filing Dt:
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06/16/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Inventor:
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Takeshi Kawakami
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Title:
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LAMINATE, BONDING METHOD, AND INTERMEDIATE PRODUCT FOR CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-10, FUKUURA, KANAZAWA-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 236-0004 |
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| LOCKE LORD LLP |
| 701 8TH ST NW, SUITE 500 |
| WASHINGTON, DC 20001 |
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05/02/2024 09:54 AM
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