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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17584146
Filing Dt:
01/25/2022
Publication #:
Pub Dt:
01/19/2023
Inventors:
Min Jae Lee, Seung Jin Yang, Kyoung Hyun Son, Tae Hee Lee, Joo Hyeon Park, Byung Wook Kim et al
Title:
THERMOELECTRIC MODULE AND A VEHICLE INCLUDING THE SAME
Assignment: 1
Reel/Frame:
058830/0460Recorded: 01/31/2022Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/01/2021
Exec Dt:
10/01/2021
Exec Dt:
10/01/2021
Exec Dt:
10/01/2021
Exec Dt:
10/01/2021
Exec Dt:
10/01/2021
Exec Dt:
10/01/2021
Exec Dt:
10/01/2021
Exec Dt:
10/01/2021
Exec Dt:
10/01/2021
Exec Dt:
10/01/2021
Assignees:
12, HEOLLEUNG-RO, SEOCHO-GU
SEOUL, KOREA, REPUBLIC OF 06797
12, HEOLLEUNG-RO, SEOCHO-GU
SEOUL, KOREA, REPUBLIC OF 06797
14, GAJAEUL-RO, SEO-GU
INCHEON, KOREA, REPUBLIC OF 22828
Correspondent:
LEMPIA SUMMERFIELD KATZ LLC
20 SOUTH CLARK STREET
SUITE 600
CHICAGO, IL 60603

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