Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2024
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Application #:
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17947673
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Filing Dt:
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09/19/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Inventors:
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Longnan JIN, Heinrich KARRER, Junfeng LIU, Huiying DING, Thomas SCHMIDT
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Title:
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SEMICONDUCTOR PACKAGE AND PACKAGING PROCESS FOR SIDE-WALL PLATING WITH A CONDUCTIVE FILM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 63 LANCASTER AVENUE |
| MALVERN, PENNSYLVANIA 19355 |
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| VOLPE KOENIG |
| 30 S. 17TH STREET |
| 18TH FLOOR |
| PHILADELPHIA, PA 19103 |
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