Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17936068
|
Filing Dt:
|
09/28/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/26/2023
| | | | |
|
Inventors:
|
Takashi Nakamitsu, Yosuke Omori, Shuhei Matsumoto
|
|
Title:
|
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING MEDIUM
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 3-1, AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
|
|
|
|
| PEARNE & GORDON LLP |
| 1801 EAST 9TH ST., SUITE 1200 |
| CLEVELAND, OH 44114-3108 |
|
|
Search Results as of:
05/04/2024 10:55 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
