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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17872338
Filing Dt:
07/25/2022
Publication #:
Pub Dt:
01/26/2023
Inventors:
Chee Yang NG, Edmund RIEDL, Joseph Victor SOOSAI PRAKASAM
Title:
ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CENTRAL INTERMETALLIC MESH STRUCTURE AND MESH-FREE EXTERIOR STRUCTURES
Assignment: 1
Reel/Frame:
063820/0208Recorded: 06/01/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/21/2023
Exec Dt:
01/30/2023
Exec Dt:
06/01/2023
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
DICKE, BILLIG & CZAJA
FIFTH STREET TOWERS
100 SOUTH FIFTH STREET, SUITE 2250
MINNEAPOLIS, 55402 UNITED STATES

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