Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17870177
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Filing Dt:
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07/21/2022
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Publication #:
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Pub Dt:
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01/26/2023
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Inventors:
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Sungjin KIM, Jincheol KIM
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Title:
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SUBSTRATE COMPRISING A LID STRUCTURE, PACKAGE SUBSTRATE COMPRISING THE SAME AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3000 SKC DRIVE |
| COVINGTON, GEORGIA 30014 |
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| NSIP LAW |
| P.O.BOX 65745 |
| WASHINGTON, DC 20035 |
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05/14/2024 10:47 AM
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