Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17667619
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Filing Dt:
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02/09/2022
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Publication #:
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Pub Dt:
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02/09/2023
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Inventors:
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Chia-Cheng Tsai, Chien-Wei Chang, Kuo-Hsin Ku, Chun Yan Chen, Chia-Chi Chung
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Title:
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SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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FAY SHARPE LLP |
1228 EUCLID AVE |
FLOOR 5 |
CLEVELAND, OH 44115 |
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06/04/2024 03:59 PM
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