Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17787424
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Filing Dt:
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06/20/2022
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Publication #:
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Pub Dt:
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02/09/2023
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Inventors:
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Yong CHEN, Yongjing XU, Guofang TANG
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Title:
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THERMOSETTING EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD USING THERMOSETTING EPOXY RESIN COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.5 WESTERN INDUSTRY ROAD, SONGSHAN LAKE NATIONAL HIGH-TECH |
| INDUSTRIAL DEVELOPMENT ZONE DONGGUAN |
| GUANGDONG, CHINA 523808 |
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| MCDONALD HOPKINS LLC |
| 600 SUPERIOR AVENUE, EAST |
| SUITE 2100 |
| CLEVELAND, 44114-2653 UNITED STATES |
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06/06/2024 11:47 AM
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