Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17975185
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Filing Dt:
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10/27/2022
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Publication #:
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Pub Dt:
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02/16/2023
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Inventors:
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Hyo Jong LEE, Han Kyun SHIN, Sang Hyeok KIM
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Title:
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MULTILAYER COPPER FOIL, METHOD FOR MANUFACTURING SAME, AND ELECTROPLATING APPARATUS TO PREPARE THE MULTILAYER COPPER FOIL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 37, NAKDONG-DAERO 550BEON-GIL SAHA-GU |
| BUSAN, KOREA, REPUBLIC OF 49315 |
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| NSIP LAW |
| P.O.BOX 65745 |
| WASHINGTON, DC 20035 |
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