Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17666437
|
Filing Dt:
|
02/07/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/16/2023
| | | | |
|
Inventors:
|
Akshay N. Singh, Bharat Bhushan, Keizo Kawakita, Bret K. Street
|
|
Title:
|
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS AND SYSTEMS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8000 S. FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
|
|
|
|
| PERKINS COIE LLP - MICRON PATENT-SEA |
| PO BOX 1247 |
| SEATTLE, WA 98111-1247 |
|
|
Search Results as of:
05/05/2024 08:12 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
