Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17759344
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Filing Dt:
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07/22/2022
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Publication #:
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Pub Dt:
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02/16/2023
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Inventors:
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YUJI NISHIDA, BERNADETTE ELLIOTT-BOWMAN, HIROHITO MIYAZAKI, CHRISTOPHER WRIGHT et al
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Title:
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SUBSTRATE AND SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-7-1 KONAN |
| MINATO-KU |
| TOKYO, JAPAN 1080075 |
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| 4-14-1 ASAHI-CHO |
| ATSUGI-SHI |
| KANAGAWA, JAPAN 2430014 |
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| CHIP LAW GROUP |
| 505 N LAKESHORE DR |
| SUITE 250 |
| CHICAGO, IL 60611 |
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04/28/2024 02:37 PM
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