Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17818123
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Filing Dt:
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08/08/2022
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Publication #:
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Pub Dt:
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02/16/2023
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Inventors:
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Yung Hsing Chu, Shan-Hui Lin, Yen-Chun Chou
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Title:
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SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR WAFERS USING FRONT-END PROCESSED WAFER GLOBAL GEOMETRY METRICS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8. INDUSTRIAL EAST ROAD 2 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| PATENT DOCKET DEPARTMENT ARMSTRONG TEASDALE LLP |
| 7700 FORSYTH BOULEVARD |
| SUITE 1800 |
| ST. LOUIS, MO 63105 |
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