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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/10/2023
Application #:
17817022
Filing Dt:
08/03/2022
Publication #:
Pub Dt:
02/16/2023
Inventor:
Yoichi TAKANO
Title:
SEMICONDUCTOR INTEGRATED CIRCUIT
Assignment: 1
Reel/Frame:
060704/0134Recorded: 08/03/2022Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/07/2022
Assignee:
2-11-2, TSURUMAKI, TAMA-SHI
TOKYO, JAPAN 206-8567
Correspondent:
BRUNDIDGE & STANGER, P.C.
1925 BALLENGER AVENUE, SUITE 560
ALEXANDRIA, VA 22314

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