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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/04/2023
Application #:
17404590
Filing Dt:
08/17/2021
Publication #:
Pub Dt:
02/23/2023
Inventors:
Lei MA, Wenyue Lydia ZHANG, Antonino SCUDERI, William Clinton Burling PEATMAN
Title:
SEMICONDUCTOR DEVICE THERMAL BUMP
Assignment: 1
Reel/Frame:
058904/0124Recorded: 02/07/2022Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/30/2021
Exec Dt:
08/30/2021
Exec Dt:
09/03/2021
Exec Dt:
09/13/2021
Assignee:
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121-1714
Correspondent:
MUNCY GEISSLER OLDS & LOWE P.C./QC
4000 LEGATO ROAD, SUITE 310
FAIRFAX, VA 22033

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