Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17858283
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Filing Dt:
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07/06/2022
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Publication #:
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Pub Dt:
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02/23/2023
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Inventors:
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Ho Jung YOU, Dong Nam SHIN, Sei Kwang OH, Yeong Beom SHIN, Tae-Woo KANG
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Title:
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METHOD OF BONDING SILICON PARTS USING SILICON POWDER AND HIGH-FREQUENCY HEATING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2 GEUMGOK-RO 257BEON-GIL, HWASEONG-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 18511 |
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| PETER S. WEISSMAN |
| 1825 EYE STREET, NW |
| WASHINGTON, DC 20006 |
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