Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17797312
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Filing Dt:
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08/03/2022
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Publication #:
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Pub Dt:
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02/23/2023
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Inventors:
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You Kubota, Rena Miyazaki, Shinya NITTA
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Title:
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Blister Package, Method For Manufacturing Blister Package, And RF Device Using Blister Package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1-1, KOISHIKAWA, BUNKYO-KU, |
| 112-0002 TOKYO, JAPAN |
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| 3-1-1, SHIBAURA, MINATO-KU, |
| TOKYO 108-0023, JAPAN |
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| TATYANA VOLOSHCHUK |
| ST. ONGE STEWARD JOHNSTON & REENS LLC |
| 986 BEDFORD STREET |
| STAMFORD, CT 06905 |
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