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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
17460097
Filing Dt:
08/27/2021
Publication #:
20230060763
Pub Dt:
03/02/2023
Inventors:
Hsu Ming HSIAO, Kung Shu HSU, Shiang-Bau WANG, Shen WANG, Hong Pin LIN, Che-Fu CHEN
Title:
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
061113/0679Recorded: 09/15/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HSIAO, HSU MING
Exec Dt:
10/24/2021
WANG, SHEN
Exec Dt:
10/27/2021
HSU, KUNG SHU
Exec Dt:
04/27/2022
LIN, HONG
Exec Dt:
10/27/2021
WANG, SHIANG-BAU
Exec Dt:
10/24/2021
CHEN, CHE-FU
Exec Dt:
12/01/2021
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET NW
WASHINGTON, DC 20001
Assignment: 2
Reel/Frame:
064237/0204Recorded: 07/10/2023Pages: 7
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE 4TH INVENTORS NAME PREVIOUSLY RECORDED AT REEL: 61113 FRAME: 679. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
HSIAO, HSU MING
Exec Dt:
10/24/2021
WANG, SHEN
Exec Dt:
10/27/2021
HSU, KUNG SHU
Exec Dt:
04/27/2022
LIN, HONG PIN
Exec Dt:
10/27/2021
WANG, SHIANG-BAU
Exec Dt:
10/24/2021
CHEN, CHE-FU
Exec Dt:
12/01/2021
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondent:
MCDERMOTT WILL & EMERY LLP
500 NORTH CAPITOL STREET, NW
WASHINGTON, DC 20001

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