Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17462709
|
Filing Dt:
|
08/31/2021
|
|
Publication #:
|
|
Pub Dt:
|
03/02/2023
| | | | |
|
Inventors:
|
Chia-Hao Pao, Chih-Hsuan Chen, Chih-Chuan Yang, Shih-Hao Lin
|
|
Title:
|
Integrated Circuit Structure with a Reduced Amount of Defects and Methods for Fabricating the Same
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| HAYNES AND BOONE, LLP (24061) IP SECTION |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
|
|
Search Results as of:
05/08/2024 10:07 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
