Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17797799
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Filing Dt:
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08/05/2022
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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Takeshi SENDA, Shingo NARIMATSU
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Title:
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MANUFACTURING METHOD FOR SEMICONDUCTOR SILICON WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-861-5, HIGASHIKO, SEIRO-MACHI |
| KITAKANBARA-GUN, NIIGATA, JAPAN 957-0197 |
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| BUCHANAN INGERSOLL & ROONEY P.C. |
| 1737 KING STREET, SUITE 500 |
| ALEXANDRIA, VA 22314-2727 |
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05/13/2024 12:42 PM
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